Measures to support the implementation of the EU Chips Act Pillar III

To move forward with the implementation of the different tasks under the pillar III of the Chips Act and provide support to the European Semiconductor Board, we need to setup a service contract providing analytical, methodological and administrative support. The objectives of this procurement are to provide analytical, methodological and administrative support to the Commission, in order to implement the EU Chips Act pillar III. Objectives include developing a methodology to address the requirements regarding the strategic mapping, monitoring and crisis activation, defining in a more operational way the critical sectors and providing support during crisis, providing analytical support (including commercial data) for all policy files relative to the semiconductor value chain.

The results will be used by the Commission and the European Semiconductor Board to fulfil the obligations stemming from the European Chips Act Pillar III.