Call for tenders Supplies
One Photonic Wafer Probe Station and one Photonic Assembly Station
Tenders due in 9 days — 2 November 2026 at 23:59
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- Public buyer
- Danmarks Tekniske Universitet - DTU
Kgs. Lyngby - Place of performance
- Kongens Lyngby
- Estimated value
- €1,250,000 excl. VAT
- Planned end of contract
- 5 December 2027
- Procedure
- Open procedure
Any company may submit a bid. - Publication
- 5 October 2026
- Notice language
- English
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Description
This tender concerns DTU Nano's planned procurement of a Photonic Assembly Station and a Photonic Wafer Probe Station. The tender is split into to two lots – one for each of the two stations. Tenderers may choose to bid on one or both lots, which will be evaluated and awarded individually.
The assembly station is for connecting fibre array units (FAUs) to an optical chip. The type of connection will be edge coupling using waveguides loops for alignment but if necessary, the alignment can also be performed either using the light source on the chip (if it exists) or by using an external light source and connecting two FAUs, one on each side of the chip. Thus, the main purpose of the machine is to do assembly and fiber attachment of photonic chips.
The system shall support research, prototyping, process development, pilot manufacturing, and low-volume production activities within DTU Nano's advanced fabrication facility. DTU has activities within Silicon Photonics (SiPh), Photonic Integrated Circuits (PICs), Optical transceivers, Laser modules, Photodetectors, Fiber-optic assemblies, Co-packaged optics and Quantum photonic devices which we want to support in the best possible way. DTU therefore intends to purchase a reconfigurable, flexible, versatile machine.
The purpose of the photonic wafer probe station is to characterise the quality of photonic integrated circuits (PICs). It should be possible to characterise both optical and electrical performance. For the optical characterisation, the main coupling in/out technique will be through grating couplers, but the equipment should be possible to be configured also for edge coupling to component facets in a grove on the wafer.
In this case, different holders and fibres may be needed. The electrical characteristics are to be characterised both in DC as well as RF up to 40GHz using probe and/or probe cards. The system shall support research, development, process qualification, and routine characterization activities within DTU Nano's advanced fabrication facility.
2 lots
- One Photonic Wafer Probe Station (Lot 1)
- One Photonic Assembly Station (Lot 2)
CPV codes
European codes that classify what the contract is about. They are how we find the tenders for your trade.
38540000 38500000 38636000 42990000
Likely competitors: who wins with this buyer in this field
- PriTel, Inc. · 1 contract won
- VWR International A/S · 1 contract won
- Ramcon A/S · 1 contract won
Partners and subcontractors
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Companies winning this type of contract in the region
- Bruker Optics GmbH & Co. KG · 1 contract won in 3 years
Possible partners for a temporary consortium or subcontracting… and competitors worth knowing.
Similar contracts already awarded
| Contract | Winner | Amount |
|---|---|---|
| Purchase of ETD (Explosive Trace Detection) equipment Københavns Lufthavne A/S · 28 September 2026 |
Bruker Optics GmbH & Co. KG | €4,575,000 |
Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 681487-2026.