Award notice Supplies
Wafer Bonder for oxidfree bonding process - PR941467-3340-P (ENAS-05)
Notice published in German. The AI analysis summarises it for you in your language.
- Public buyer
- Fraunhofer-Gesellschaft - Einkauf B12
München - Place of performance
- Chemnitz
- Planned end of contract
- 30 June 2027
likely re-tender around December 2026 - Bids received
- 2
- Procedure
- Competitive negotiated procedure
You first submit an application; shortlisted candidates bid, then negotiate with the buyer. - Publication
- 13 July 2026
- Notice language
- German
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Description
Wafer Bonder for oxidfree bonding process
Awarded to
CPV codes
European codes that classify what the contract is about. They are how we find the tenders for your trade.
31712100
Winning prices for comparable contracts
- A quarter below
- €306,739
- Median
- €574,130
- A quarter above
- €766,284
Amounts awarded (excl. VAT) over the last 3 years for 8 contracts in the same CPV group (3171…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.
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Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 481922-2026.