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Wafer Bonder for oxidfree bonding process - PR941467-3340-P (ENAS-05)

Notice published in German. The AI analysis summarises it for you in your language.

Public buyer
Fraunhofer-Gesellschaft - Einkauf B12
München
Place of performance
Chemnitz
Planned end of contract
30 June 2027
likely re-tender around December 2026
Bids received
2
Procedure
Competitive negotiated procedure
You first submit an application; shortlisted candidates bid, then negotiate with the buyer.
Publication
13 July 2026
Notice language
German

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Description

Wafer Bonder for oxidfree bonding process

Awarded to

CPV codes

European codes that classify what the contract is about. They are how we find the tenders for your trade.

31712100

Winning prices for comparable contracts

A quarter below
€306,739
Median
€574,130
A quarter above
€766,284

Amounts awarded (excl. VAT) over the last 3 years for 8 contracts in the same CPV group (3171…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.

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Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 481922-2026.