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Clustertool for Ion Beam Etching of 300mm wafers

Notice published in German. The AI analysis summarises it for you in your language.

Public buyer
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Erlangen
Place of performance
Erlangen
Bids received
1
Procedure
Competitive negotiated procedure
You first submit an application; shortlisted candidates bid, then negotiate with the buyer.
Publication
10 July 2026
Notice language
German

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Description

The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. Therefore, it is necessary to fulfill require-ments regarding metal contamination and particle generation compatible with industry standards.

Awarded to

CPV codes

European codes that classify what the contract is about. They are how we find the tenders for your trade.

42900000

Winning prices for comparable contracts

A quarter below
€1
Median
€55,426
A quarter above
€202,400

Amounts awarded (excl. VAT) over the last 3 years for 8 contracts in the same CPV group (4290…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.

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Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 476033-2026.