Award notice Supplies
Clustertool for Ion Beam Etching of 300mm wafers
Notice published in German. The AI analysis summarises it for you in your language.
- Public buyer
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Erlangen - Place of performance
- Erlangen
- Bids received
- 1
- Procedure
- Competitive negotiated procedure
You first submit an application; shortlisted candidates bid, then negotiate with the buyer. - Publication
- 10 July 2026
- Notice language
- German
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Description
The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. Therefore, it is necessary to fulfill require-ments regarding metal contamination and particle generation compatible with industry standards.
Awarded to
CPV codes
European codes that classify what the contract is about. They are how we find the tenders for your trade.
42900000
Winning prices for comparable contracts
- A quarter below
- €1
- Median
- €55,426
- A quarter above
- €202,400
Amounts awarded (excl. VAT) over the last 3 years for 8 contracts in the same CPV group (4290…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.
Similar contracts already awarded
Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 476033-2026.