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Award notice Supplies

Defect inspection system

Public buyer
VTT Technical Research Centre of Finland Ltd
VTT
Place of performance
Espoo
Amount awarded
€1,190,000 excl. VAT
Planned end of contract
6 December 2027
likely re-tender around June 2027
Bids received
3
Procedure
Open procedure
Any company may submit a bid.
Publication
14 October 2026
Notice language
English

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Description

VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool must be capable of detecting particles, voids, cracks, scratches, pits, bumps, and hazes in the pattern.

The materials of the patterns that the machine must be able to analyze are silicon oxides and nitrides, polysilicon, metals, and photoresist. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.

Awarded to

CPV codes

European codes that classify what the contract is about. They are how we find the tenders for your trade.

38000000

Winning prices for comparable contracts

A quarter below
€193,600
Median
€418,300
A quarter above
€602,500

Amounts awarded (excl. VAT) over the last 3 years for 32 contracts in the same CPV group (3800…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.

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Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 710873-2026.