Award notice Supplies
Defect inspection system
- Public buyer
- VTT Technical Research Centre of Finland Ltd
VTT - Place of performance
- Espoo
- Amount awarded
- €1,190,000 excl. VAT
- Planned end of contract
- 6 December 2027
likely re-tender around June 2027 - Bids received
- 3
- Procedure
- Open procedure
Any company may submit a bid. - Publication
- 14 October 2026
- Notice language
- English
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Description
VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool must be capable of detecting particles, voids, cracks, scratches, pits, bumps, and hazes in the pattern.
The materials of the patterns that the machine must be able to analyze are silicon oxides and nitrides, polysilicon, metals, and photoresist. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Awarded to
CPV codes
European codes that classify what the contract is about. They are how we find the tenders for your trade.
38000000
Winning prices for comparable contracts
- A quarter below
- €193,600
- Median
- €418,300
- A quarter above
- €602,500
Amounts awarded (excl. VAT) over the last 3 years for 32 contracts in the same CPV group (3800…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.
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| Contract; University of Turku, a M-Class and Prep 150 system University of Turku (Turun yliopisto) · 19 October 2026 |
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Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 710873-2026.