PublizoomAward notice Supplies
Wafer metrology
- Public buyer
- VTT Technical Research Centre of Finland Ltd
VTT - Place of performance
- Espoo
- Amount awarded
- €464,674 excl. VAT
- Planned end of contract
- 1 July 2029
likely re-tender around January 2029 - Bids received
- 1
- Procedure
- Open procedure
Any company may submit a bid. - Publication
- 31 August 2026
- Notice language
- English
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Description
The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.
Awarded to
CPV codes
European codes that classify what the contract is about. They are how we find the tenders for your trade.
38000000 38300000
Winning prices for comparable contracts
- A quarter below
- €193,600
- Median
- €418,300
- A quarter above
- €602,500
Amounts awarded (excl. VAT) over the last 3 years for 32 contracts in the same CPV group (3800…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.
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Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 598555-2026.