PublizoomAward notice Supplies
Flip Chip Die Bonder
Notice published in German. The AI analysis summarises it for you in your language.
- Public buyer
- FAIR - Facility for Antiproton and Ion Research in Europe GmbH
Darmstadt - Place of performance
- Darmstadt
- Amount awarded
- €234,757 excl. VAT
- Planned end of contract
- 28 November 2026
likely re-tender around October 2026 - Bids received
- 1
- Procedure
- Open procedure
Any company may submit a bid. - Publication
- 29 September 2026
- Notice language
- German
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Description
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Awarded to
CPV codes
European codes that classify what the contract is about. They are how we find the tenders for your trade.
38000000
Winning prices for comparable contracts
- A quarter below
- €121,025
- Median
- €244,385
- A quarter above
- €458,150
Amounts awarded (excl. VAT) over the last 3 years for 88 contracts in the same CPV group (3800…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.
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Ushio Germany GmbH | €850,000 |
| Herstellung von Zylinderlinsen - PR1274622-2660-W Fraunhofer-Gesellschaft - Einkauf B12 · 22 October 2026 |
asphericon GmbH | – |
Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 667627-2026.