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Feol etch cluster

Notice published in Dutch. The AI analysis summarises it for you in your language.

Public buyer
Imec EU Pilot line NV
Heverlee
Place of performance
3001 Heverlee, Flemish Brabant
not published: buyer's address
Bids received
3
Procedure
Competitive negotiated procedure
You first submit an application; shortlisted candidates bid, then negotiate with the buyer.
Publication
21 July 2026
Notice language
Dutch

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Description

300mm Dry Etch Platform bestaande uit een Process Module zoals hieronder omschreven: i. Conductor Dry Ether met ICP (Inductively Coupled Plasma) RF Source Power en Dual Bottom Bias capability (RF Bias + DC Pulse Bias aan 400kHz) ii. Deze Process Module moet het vermogen hebben om RF Bias en DC Bias te superponeren.

Deze Process Module is bedoeld voor verschillende FEOL-toepassingen voor N2 technologie node en verder, in het bijzonder CFET (Complementary Field Effect Transistor) toepassingen inclusief maar niet beperkt tot CFET Nanosheet Etch, CFET Full Gate Etch en CFET Source/Drain Recess. Er moeten minimaal 6 procesmoduleslots beschikbaar zijn op het platform voor een mogelijke capaciteits- en functionaliteitsupgrade. Het platform moet minimaal 5 laadpoorten bevatten.

Awarded to

CPV codes

European codes that classify what the contract is about. They are how we find the tenders for your trade.

38000000

Winning prices for comparable contracts

A quarter below
€251,579
Median
€391,000
A quarter above
€678,903

Amounts awarded (excl. VAT) over the last 3 years for 127 contracts in the same CPV group (3800…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.

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Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 503557-2026.