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Notice of discontinuation: Edge-Handling Sputtering Cluster Tool

Public buyer
VTT Technical Research Centre of Finland Ltd
VTT
Place of performance
Espoo
Planned end of contract
1 January 2028
likely re-tender around July 2027
Bids received
2
Procedure
Open procedure
Any company may submit a bid.
Publication
14 October 2026
Notice language
English

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Description

The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources.

During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.

CPV codes

European codes that classify what the contract is about. They are how we find the tenders for your trade.

38000000

Winning prices for comparable contracts

A quarter below
€193,600
Median
€418,300
A quarter above
€602,500

Amounts awarded (excl. VAT) over the last 3 years for 32 contracts in the same CPV group (3800…), excluding framework agreements. Half of the contracts fall between the two quartiles. TED source: mostly contracts above the EU thresholds, so amounts tend to be high.

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Wafer metrology
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Anechoic Radio Frequency (RF) Chamber
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ETS-Lindgren Oy €584,900

Source : TED – Office des publications de l'Union européenne © Union européenne, données retraitées. Reference 707454-2026.